Microscale Bonding Strength of Cu-Fe-Al Transferred Lamellar Microstructure Formed by Copper-Coated Seel Fine Particle Peening
₩4,000
“Microscale Bonding Strength of Cu-Fe-Al Transferred Lamellar Microstructure Formed by Copper-Coated Seel Fine Particle Peening”의 첫 상품평을 남겨주세요
상품평 작성을 위해 로그인이 필요합니다.
연관 상품
-
Stirring a polariton condensate using a special laser beam
- Log in to view price and purchase
-
Turning the tables on weather forecasting
- Log in to view price and purchase
-
Scientists successfully manipulate a single skyrmion at room temperature
- Log in to view price and purchase
상품평
아직 상품평이 없습니다.