Superplastic bonding was performed using electrodeposited Ni and electrodeposited Ni–B to apply to low–temperature diffusion bonding of carbon steel. Electrodeposited
Ni and Ni–B were bonded at 450ÿ in air and at a strain rate of 1 × 10ÿ4 sÿ1 The shear test measured the bond strength, and the maximum bond strength of 69 MPa was obtained.
Since the obtained bonding strength at 450ÿ is comparable to that obtained by diffusion bonding of carbon steel at 0.5Tm, it is possible to decrease the bonding temperature to
0.4Tm by applying this boning process. The bonding strength depended on the amount of strain and increased as the strain increased in the range of strain 0.2 to 0.4. The voids at
the interface shrink by superplastic deformation with grain boundary sliding, and the bonded area increases. In the superplastic bonding of electrodeposited Ni alloys, superplastic
deformation effectively shrinks voids with a radius of 1–2 μm.